Service
Research
Counterfeit Analysis & Reverse Engineering
고객 Needs 에 따른 Soc, Package 및 Board Level에서의 정밀분석 서비스
Reverse Engineering
Level 1
Package Information
Package general
Bump Information(Optional)
Die Information
Die general
Level 2
Package Information
Package general
Bump Information(Optional)
Die Information
Die general
Package details
Wire bond profile
Die attach/Ball structure
Substrate general
Substrate Net extraction (optional)
Level 3
Package Information
Package general
Bump Information(Optional)
Die Information
Die general
Package details
Wire bond profile
Die attach/Ball structure
Substrate general
Substrate Net extraction (optional)
Layers information
Process Technology Node
Functional Block schematics
Metal Gate scheme
Level 4
Package Information
Package general
Bump Information(Optional)
Die Information
Die general
Package details
Wire bond profile
Die attach/Ball structure
Substrate general
Substrate Net extraction (optional)
Layers information
Process Technology Node
Functional Block schematics
Metal Gate scheme
Netlist Extraction
Metal layout per Layers
Metal Layout/Substrate Netlist extraction
Standard Cell scheme/composition
Finfet structure/composition
